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1 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 benefts ? s urface mount form factor ? operating ambient temperature of ?40c to +85c ? o perating voltage range of 14 to 385 vdc ? o perating voltage (vrms) of 11 v to 300 v ? a vailable case sizes: 3255 and 4032 ? d imensional and weight savings on the board ? non-fammable thermoplastic encapsulation according to th e standard ul 94 v-0 ? u l 1449, 3rd edition and csa c22.2. file e326499 section 3 ? r ohs 2 2011/65/ec, reach compliant overview kemet's vp series of low and medium voltage plastic- encapsulated varistors are designed to protect electronic equipment against high voltage surges in the low and medium voltage region. they offer direct surface mount equivalents to leaded disc varistors of 5 and 7 mm sizes. the thermoplastic encapsulation is non-fammable accor ding to the standard ul 94 v-0. contacts are made of tinned copper sheet. these transient voltage suppressors cover an operating voltage vrms from 11 v to 300 v, featuring maximum surge currents from 100 a to 1,200 a. applications typical applications include medical instruments, integrated circuits and transistors, mobile communication, white goods, entertainment electronics, lighting ballast, as well as protection of low and medium voltage boards, remote control and electrical counters and applications that are exposed to humidity. surface mount varistors vp series plastic encapsulated 85c one world. one kemet
2 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 ordering information vp 3225 k 101 r 011 series chip size code tolerances rated peak single pulse transient current (a) packaging/ termination maximum continuous working voltage (vrms ac) varistor smd 85c plastic encapsulated 3225 = 3225 4032 = 4032 k = 10% 101 = 100 251 = 250 401 = 400 122 = 1,200 (first two digits represent signifcant fgures. third digit s pecifes number of zeros.) r = reel 330 mm 011 = 11 014 = 14 017 = 17 020 = 20 025 = 25 030 = 30 035 = 35 040 = 40 050 = 50 060 = 60 075 = 75 095 = 95 115 = 115 130 = 130 140 = 140 150 = 150 175 = 175 230 = 230 250 = 250 275 = 275 300 = 300 dimensions C millimeters t 5 size code voltage range v l 0.5 mm w 0.4 mm h 0.3 mm t 0.3 mm 3225 11 C 150 8.0 6.3 1.7 3.4 3225 175 C 300 8.0 6.3 2.3 4.7 4032 11 C 300 10.0 8.0 2.3 4.7 surface mount varistors vp series plastic encapsulated 85c
3 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 environmental compliance rohs 2 2011/65/ec, reach performance characteristics continuous units value steady state applied voltage dc voltage range (v dc ) v 14 to 385 ac voltage range (v rms ) v 11 to 300 transient non-repetitive surge current, 8/20 s waveform (i max ) a 100 to 1200 non-repetitive surge energy, 10/1000 s waveform (w max ) j 0.6 to 30 operating ambient temperature c ?40 to +85 storage temperature c ?40 to +125 threshold voltage temperature coeffcient %/c < + 0.05 response time ns < 5 climatic category 40/85/56 qualifcations reliability parameter test tested according to condition to be satisfed after testing ac/dc bias reliability ac/dc life test cecc 42200, test 4.20 or iec 1051C1, test 4.20. aecCq200 test 8 C 1,000 hours at uct | vn (1 ma)| < 10 % pulse current capability i max 8/20 s cecc 42200, test c 2.1 or iec 1051C1, test 4.5. 10 pulses in the same direction at 2 pulses per minute at maximum peak current for 10 pulses | vn (1 ma)| < 10 % no visible damage pulse energy capability w max 10/1,000 s cecc 42200, test c 2.1 or iec 1051C1, test 4.5. 10 pulses in the same direction at 1 pulses every 2 minutes at maximum peak current for 10 pulses | vn (1 ma)| < 10 % no visible damage wld capability wld x 10 iso 7637, test pulse 5, 10 pulses at rate 1 per minute | increase of supply voltage to v v jump for 1 minute | surface mount varistors vp series plastic encapsulated 85c
4 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 qualifcations cont'd reliability parameter test tested according to condition to be satisfed after testing environmental and storage reliability climatic sequence cecc 42200, test 4.16 or iec 1051C1, test 4.17. a) dry heat, 16 hours, uct, test ba, iec 68C2C2 b) damp heat, cyclic, the frst cycle: 55c, 93 % rh, 2 4 hours, test db 68C2C4 c) cold, lct, 2 hours test aa iec 68C2C1 d) damp heat cyclic, remaining 5 cycles: 55c, 93 % r h, 24 hour/cycle, test bd, iec 68C2C30 | vn (1 ma)| < 10 % thermal shock cecc 42200, test 4.12, test na, iec 68C2C14, aecCq200 test 16, 5 cycles uct/lct, 30 minutes | vn (1 ma)| < 10 % no visible damage steady state damp heat cecc 42200, test 4.17, test ca, iec 68C2C3, aecCq200 test 6, 56 days, 40c, 93% rh. aecCq200 t est7: bias, rh, t all at 85. | vn (1 ma)| < 10 % storage test iec 68C2C2, test ba, aecCq200 test 3, 1,000 hours at maximum storage temperature | vn (1 ma)| < 5 % mechanical reliability solderability cecc 42200, test 4.10.1, test ta iec 68C2C20 solder bath and refow method solderable at shipment and after 2 year of storage, criteria > 95% must be covered by solder for refow m eniscus resistance to soldering heat cecc 42200, test 4.10.2, test tb, iec 68C2C20 solder bath and refow method | vn (1 ma)| < 5 % terminal strength jisCcC6429, app. 1, 18n for 60 seconds C same for aecCq200 test 22 no visual damage board flex jisCcC6429, app. 2, 2 mm minimum aecCq200 test 21 C board fex: 2 mm fex minimum | vn (1 ma)| < 2 % no visible damage vibration cecc 42200, test 4.15, test fc, iec 68C2C6, aecC q200 test 14. frequency range 10 to 55 hz (aec: 10 C 2,000 hz) amplitude 0.75 m/s2 or 98 m/s2 (aec: 5 g's for 20 minutes) total duration 6 hours (3x2h) (aec: 12 cycles each of 3 directions) waveshape C half sine | vn (1 ma)| < 10 % no visible damage mechanical shock cecc 42200, test 4.14, test ea, iec 68C2C27, aecCq200 test 13. acceleration = 490 m/s2 (aec: mil-stdC202Cmethod 213), pulse duration = 11 ms, waveshape C half sine; number of shocks = 3x6 | vn (1 ma)| < 10 % no visible damage electrical transient conduction isoC7637C1 pulses aecCq200 test 30: test pulses 1 to 3. also other pulses C freestyle. | vn (1 ma)| < 10 % no visible damage surface mount varistors vp series plastic encapsulated 85c
5 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 table 1 C ratings & part number reference kemet part number h 0.3 (mm) l 0.5 (mm) w 0.4 (mm) t 0.3 (mm) v rms vdc v n 1 ma v c i c w max 10/1,000 s (j) p max (w) i max 8/20 s (a) c typ at 1 khz (pf) vp3225k101r011 1.7 8.0 6.3 3.4 11 14 18 36 2.5 0.6 0.01 100 1600 vp4032k251r011 2.3 10.0 8.0 4.7 11 14 18 36 5 1.1 0.02 250 3100 vp3225k101r014 1.7 8.0 6.3 3.4 14 18 22 43 2.5 0.7 0.01 100 1300 vp4032k251r014 2.3 10.0 8.0 4.7 14 18 22 43 5 1.3 0.02 250 2500 vp3225k101r017 1.7 8.0 6.3 3.4 17 22 27 53 2.5 0.9 0.01 100 1050 vp4032k251r017 2.3 10.0 8.0 4.7 17 22 27 53 5 1.6 0.02 250 1900 vp3225k101r020 1.7 8.0 6.3 3.4 20 26 33 65 2.5 1.1 0.01 100 750 vp4032k251r020 2.3 10.0 8.0 4.7 20 26 33 65 5 2.0 0.02 250 1500 vp3225k101r025 1.7 8.0 6.3 3.4 25 31 39 77 2.5 1.2 0.01 100 660 vp4032k251r025 2.3 10.0 8.0 4.7 25 31 39 77 5 2.4 0.02 250 1260 vp3225k101r030 1.7 8.0 6.3 3.4 30 38 47 93 2.5 1.5 0.01 100 580 vp4032k251r030 2.3 10.0 8.0 4.7 30 38 47 93 5 2.8 0.02 250 1050 vp3225k101r035 1.7 8.0 6.3 3.4 35 45 56 110 2.5 1.8 0.01 100 460 vp4032k251r035 2.3 10.0 8.0 4.7 35 45 56 110 5 3.4 0.02 250 850 vp3225k101r040 1.7 8.0 6.3 3.4 40 56 68 135 2.5 2.2 0.01 100 400 vp4032k251r040 2.3 10.0 8.0 4.7 40 56 68 135 5 4.1 0.02 250 720 vp3225k401r050 1.7 8.0 6.3 3.4 50 65 82 135 5 2.5 0.1 400 390 vp4032k122r050 2.3 10.0 8.0 4.7 50 65 82 135 10 6.5 0.25 1200 820 vp3225k401r060 1.7 8.0 6.3 3.4 60 85 100 165 5 3.0 0.1 400 330 vp4032k122r060 2.3 10.0 8.0 4.7 60 85 100 165 10 7.0 0.25 1200 680 vp3225k401r075 1.7 8.0 6.3 3.4 75 100 120 200 5 4.0 0.1 400 270 vp4032k122r075 2.3 10.0 8.0 4.7 75 100 120 200 10 9.0 0.25 1200 550 VP3225K401R095 1.7 8.0 6.3 3.4 95 125 150 250 5 6.0 0.1 400 220 vp4032k122r095 2.3 10.0 8.0 4.7 95 125 150 250 10 11.0 0.25 1200 440 vp3225k401r115 1.7 8.0 6.3 3.4 115 150 180 300 5 6.5 0.1 400 180 vp4032k122r115 2.3 10.0 8.0 4 .7 115 150 180 300 10 13.0 0.25 1200 360 vp3225k401r130 1.7 8.0 6.3 3.4 130 170 205 340 5 7.0 0.1 400 160 vp4032k122r130 2.3 10.0 8.0 4.7 130 170 205 340 10 15.0 0.25 1200 320 vp3225k401r140 1.7 8.0 6.3 3.4 140 180 220 360 5 7.5 0.1 400 150 vp4032k122r140 2.3 10.0 8.0 4.7 140 180 220 360 10 18.0 0.25 1200 300 vp3225k401r150 1.7 8.0 6.3 3.4 150 200 240 395 5 9.0 0.1 400 140 vp4032k122r150 2.3 10.0 8.0 4.7 150 200 240 395 10 18.5 0.25 1200 280 vp3225k401r175 1.7 8.0 6.3 4.7 175 225 270 455 5 9.5 0.1 400 120 vp4032k122r175 2.3 10.0 8.0 4.7 175 225 270 455 10 21.0 0.25 1200 250 vp3225k401r230 1.7 8.0 6.3 4.7 230 300 360 595 5 10.0 0.1 400 95 vp4032k122r230 2.3 10.0 8.0 4.7 230 300 360 595 10 23.0 0.25 1200 190 vp3225k401r250 1.7 8.0 6.3 4.7 250 320 390 650 5 11.0 0.1 400 80 vp4032k122r250 2.3 10.0 8.0 4.7 250 320 390 650 10 25.0 0.25 1200 180 vp3225k401r275 1.7 8.0 6.3 4.7 275 350 430 710 5 13.0 0.1 400 75 vp4032k122r275 2.3 10.0 8.0 4.7 275 350 430 710 10 29.0 0.25 1200 160 vp3225k401r300 1.7 8.0 6.3 4.7 300 385 470 775 5 15.0 0.1 400 70 vp4032k122r300 2.3 10.0 8.0 4.7 300 385 470 775 10 30.0 0.25 1200 150 kemet part number h 0.3 mm l 0.5 mm w 0.4 mm t 0.3 mm v rms v v dc v v n 1 ma v v c v i c a w max 10/1,000 s j p max w i max 8/20 s a c typ @ 1 khz pf surface mount varistors vp series plastic encapsulated 85c
6 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 soldering popular soldering techniques used for surface mounted components are wave and infrared refow processes. both processes can be per formed with pb-containing or pb-free solders. the termination option available for these soldering techniques is barrier type end terminations. end termination designation recommended and suitable for component rohs compliant ni sn barrier type end termination ni r1 pb-containing and pb-free soldering yes wave soldering C this process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. smd varistors to be wave soldered are frst glued to the circuit board, usually with an epoxy adhesive. when all components on the pcb ha ve been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. infrared refow soldering C these refow processes are typically associated with top-side component placement. this technique utilizes a mixture of adhesive and solder compounds (and sometimes fuxes) that are blended into a paste. the paste is then screened onto pcb soldering pads specifcally designed to accept a particular sized smd component. the recommended solder paste wet layer thickness is 100 to 300 m. once the circuit board is fully populated with md components, it is placed in a refow environment, where the paste is heated to slightly above its eutectic temperature. when the solder paste refows, the smd components are attached to the solder pads. solder fluxes C solder fuxes are generally applied to populated circuit boards to clean oxides forming during the heating process and to facilitate the fowing of the solder. solder fuxes can be either a part of the solder paste compound or can be separate materials, usually fuids. recommended fuxes are: ? non-activated (r) fuxes, whenever possible ? mildly activated (rma) fuxes of class l3cn ? class orl o activ ated (ra), water soluble or strong acidic fuxes with a chlorine content > 0.2 wt. % are not recommended. the use of such fuxes could cr eate high leakage current paths along the body of the varistor components. when a fux is applied prior to wave soldering, it is important to completely dry any residual fux solvents prior to the soldering process. thermal shock C to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 c of the peak soldering process temperature is recommended. additionally, smd varistors should not be subjected to a temperature gr adient greater than 4 c/sec., with an ideal gradient being 2 c/sec. peak temperatures should be controlled. wave and refow soldering conditions for smd varistors with pb-containing solders ar e shown in fig. 1 and 2 r espectively, while w ave and refow soldering conditions for smd v aristors with pb-free solders are shown in fig, 1 and 3 surface mount varistors vp series plastic encapsulated 85c
7 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 soldering cont'd whenever several different types of smd components are being soldered, each having a specifc soldering profle, the soldering profle with the least heat and the minimum amount of heating time is r ecommended. once soldering has been completed, it is necessary to minimize the possibility of thermal shock by allowing the hot pcb to cool to less than 50 c before cleaning. inspection criteria C the inspection criteria to determine acceptable solder joints, when wave or infrared refow processes are used, will depend on several key variables, principally termination material process profles. pb-contining wave and ir refow soldering C typical before and after soldering results for barrier type end terminations can be seen in fig. 4. barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. the bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. the results exceed established industry standards for adhesion. the solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy (over the barrier layer), and due to its small volume climbs the outer surface of the terminations, the meniscus will be slightly lower. this optical appearance should be taken into consideration when programming visual inspection of the pcb after soldering. ni sn barrier type end terminations fig. 4 C soldering criterion in case of wave and ir refow pb-containing soldering pb-fr ee wave and ir refow soldering C typical before and after soldering results for barrier type end terminations are given in a phenomenon knows as mirror or negative meniscus. solder forms a metallurgical junction with the entire volume of the end termination, i.e. it diffuses from pad to end termination across the inner side, forming a mirror or negative meniscus. the height of the solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height. surface mount varistors vp series plastic encapsulated 85c
8 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 soldering cont'd solder test and retained samples C refow soldering test based on j-std-020d.1 and soldering test by dipping based on iec 60068- 2 for pb-free solders are preformed on each production lot as shown in the following chart. test results and accompanying samples are retained for a minimum of two (2) years. the solderability of a specifc lot can be checked at any time within this period should a cust omer require this information. test resistance to flux solderability static leaching (simulation of refow soldering) dynamic leaching (simulation of wave soldering) parameter soldering method dipping dipping dipping dipping with agitation flux l3cn, orl0 l3cn, orl0, r l3cn, orl0, r l3cn, orl0, r pb solder 62sn/36pb/2 ag pb s oldering t emperature ( c) 2355 2355 2605 2355 pb-free solder sn96/cu0,4C0,8/3C4ag pb-free soldering temperature (c) 2505 2505 2805 2505 soldering time (s) 2 210 10 > 15 burn-in conditions vdc max , 48 h acceptance criterion dvn < 5 %, i dc must stay unchanged > 95 % of end termination must be covered by solder > 95 % of end termination must be intact and covered by solder > 95 % of end termination must be intact and covered by solder rework criteria soldering iron C unless absolutely necessary, the use of soldering irons is not recommended for reworking varistor chips. if no other means of rework is available, the following criteria must be strictly followed: ? do not allow the tip of the iron to directly contact the top of the chip ? do not exceed the following soldering iron specifcations: output p ower: 30 w atts maximum temperature of soldering iron tip: 280c maximum soldering time: 10 seconds maximum st orage conditions C smd varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. the storage environment should be controlled, with humidity less than 40% and temperature between -25 and 45 c. varistor chips should alwa ys be stored in their original packaged unit. surface mount varistors vp series plastic encapsulated 85c
9 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 soldering pad confguration t w l 1.50.3 3.00.3 h b c b a d a size voltage range v l 0.5 mm w 0.4 mm h 0.3 mm t 0.3 mm a (mm) b (mm) c (mm) d (mm) 3225 11 C 150 8.0 6.3 1.7 3.4 3.5 2.9 4.5 10.3 3225 175 C 300 8.0 6.3 2.3 4.7 3.5 2.9 4.5 10.3 4032 11 C 300 10.0 8.0 2.3 4.7 3.5 2.9 6.5 12.3 packaging voltage range (v) chip size 3225 4032 6iip7mi 330 330 < 175 1500 1000 > 175 1000 1000 surface mount varistors vp series plastic encapsulated 85c
10 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 construction current below 50 v detailed cross section molded epoxy case molded epoxy case ag electrode ag electrode zno layer glass passivation termination (ag/pd, ni/sn) termination (ag/pd, ni/sn) current equal or greater than 50 v molded epoxy case molded epoxy case glass passivation termination (ag/pd, ni/sn) surface mount varistors vp series plastic encapsulated 85c
11 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 marking tradename series name model size v n tolerance v rms surface mount varistors vp series plastic encapsulated 85c
12 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 taping & reel specifcations tape size (mm) 16 mm 3225 4032 ao 7.8 10.8 bo 3.7 3.7 ko maximum 12.1 12.1 b 1 maximum 1.5 1.5 d 1 minimum 14.25 14.25 e 2 minimum 12 12 p 1 7.5 7.5 f 16.0 16.0 w 9.5 9.5 t 2 maximum 16.4+2 16.4+2 w 1 12.4+2 12.4+2 w 2 maximum 22.4 22.4 w 3 15.919.4 15.919.4 a 330 330 surface mount varistors vp series plastic encapsulated 85c
13 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 terms and defnitions term symbol defnition rated ac voltage v rms maximum continuous sinusoidal ac voltage (<5% total harmonic distortion) which may be applied to the component under continuous operation conditions at 25c rated dc voltage v dc maximum continuous dc voltage (<5% ripple) which may be applied to the component under continuous operating conditions at 25c the current passing through the varistor at vdc and at 25c or at any other specifed temperature varistor voltage v n voltage across the varistor measured at a given reference current in reference current i n reference current = 1 ma dc clamping voltage protection level v c the peak voltage developed across the varistor under standard atmospheric conditions, when passing an 8/20 s class current pulse minute for the 8/20 s pulse a fgure of merit measure of the varistor clamping effectiveness as defned by the symbols v c /v app , where (v app = v rms or v dc ) jump start transient v jump the jump start transient resulting from the temporary application of an overvoltage in excess of the rated battery voltage. the circuit power supply may be subjected to a temporary overvoltage condition due to the voltage regulation failing or it may be deliberately generated when it becomes necessary to boost start the car rated single pulse transient energy w max energy which may be dissipated for a single 10/1000 s pulse of a maximum rated current, with rated ac voltage or rated dc voltage also applied, without causing device failure load dump transient wld load dump is a transient which occurs in an automotive environment. it is an exponentially decaying positive voltage which occurs in the event of a battery disconect while the alternator is still generating charging current with other loads remaining on the alternator circuit at the time of battery disconect rated peak single pulse transient current i max maximum peak current which may be applied for a single 8/20 s pulse, with, rated line vo ltage also applies, without causing device failure rated transient average power dissipation p maximum average power which may be dissipated due to a group of pulses occurring within a specifed isolated time period, without causing device failure at 25c capacitance c capacitance between two terminals of the varistor measured at at 1 khz response time tr the time lag between application of a surge and varistor's "turn-on" conduction action varistor voltage temperature coeffcient at 85c C v n at 25c)/(v n at 25c) x 60c) x 100 i nsulation resistance ir minimum resistance between shorted terminals and varistor surface isolation voltage the maximum peak voltage which may be applied under continuous operating conditions between the varistor terminations and any conducting mounting surface operating temperature the range of ambient temperature for which the varistor is designed to operate continuously as defned by the temperature limits of its climatic category surface mount varistors vp series plastic encapsulated 85c
14 ? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com v 0005_vp ? 11/3/2016 kemet electronic corporation sales off ces for a complete list of our global sales off ces, please visit www.kemet.com/sales. disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. kemet is a registered trademark of kemet electronics corporation. surface mount varistors vp series plastic encapsulated 85c

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